Foundation Stone Laid in Bhubaneswar for India's First 3D Semiconductor Packaging Unit

On 19 April 2026, the foundation stone for India's first advanced 3D semiconductor packaging unit was laid at Info Valley in Khordha district near Bhubaneswar, Odisha. Odisha Chief Minister Mohan Charan Majhi and Union Minister for Electronics and IT Ashwini Vaishnaw performed the ground-breaking ceremony for the project, which will be implemented by US-based 3D Glass Solutions Inc through its Indian subsidiary, Heterogenous Integration Packaging Solutions Pvt Ltd (HIPSPL).

The total project cost is Rs 1,943.53 crore. The Centre will provide fiscal support of around Rs 799 crore under the India Semiconductor Mission, while the Odisha government will contribute around Rs 399.5 crore. Unlike traditional packaging that uses organic substrates or silicon, this facility will use glass substrates to vertically stack and connect chip components — a technique known as 3D Heterogeneous Integration (3DHI). Glass offers a lower dielectric constant than silicon, which improves signal speed and integrity in advanced chips.

Once fully operational, the plant is projected to produce around 70,000 glass panels, 50 million assembled units and 13,000 advanced 3DHI modules per year. Commercial production is targeted for August 2028, with volume output by August 2030. The facility is expected to create around 2,500 direct and indirect jobs and will supply chips for artificial intelligence, high-performance computing, 5G/6G telecom, automotive radar, defence electronics and aerospace.

For India, the unit is a step toward reducing dependence on chip imports — currently a major strategic and current-account vulnerability. Odisha now becomes the only Indian state hosting both a compound semiconductor fabrication unit and a 3D glass substrate packaging unit on the same campus, strengthening its case as an emerging semiconductor hub alongside Gujarat and Tamil Nadu.

Exam angle: This story links to the India Semiconductor Mission, advanced packaging (OSAT, ATMP, 3DHI), the 'Make in India' electronics push, and centre-state co-financing of industrial projects. UPSC GS-3 (science & tech, infrastructure, indigenisation), SSC and Banking GA can ask about the location, the company, the investment figure or the technology.